Qualcomm’s new smartphone modem aims to bridge tricky coverage situations

An illustration of the Qualcomm logo.
Qualcomm has a new modem-RF chip ready in time for Mobile World Congress. | Illustration by Alex Castro / The Verge

Qualcomm is warming up for Mobile World Congress by announcing its newest modem: the Snapdragon X75. It updates last year’s X70, which is in the Snapdragon 8 Gen 2-powered phones just hitting the market like the Samsung S23 Ultra and OnePlus 11 5G. This time around, Qualcomm is getting its modem-RF chip ready for the next wave of 5G advances, along with enabling more powerful uplink and downlink connections, and using AI to help your phone stay better connected in tricky spots.

The X75 is equipped for 3GPP’s release 17 and 18, which establish the standards for the next phases of 5G technology. Release 18, in particular, marks the start of a phase called 5G Advanced, which is where we’ll see 5G in more applications like connected cars and…

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